ADS6303 series is a high-resolution dToF chip that uses the world's leading 3D stacking technology (Cu-Cu Hybrid bonding) to achieve 240x160 array resolution. The dToF imaging module can realize the depth imaging without distortion field of view of 60 x 45. The maximum distance can reach 26 meters indoors and 10 meters outdoors, and the frame rate is up to 60Hz with centimeter-level accuracy.