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SiFotonics PD6005-08M3-T chip provides high performance and high reliability solution for 800G/1.6T optical interconnection application scenarios with single wave 200G. It is based on the Ge/Si CMOS process line, integrates the micro-lens and TSV compatible with the packaging requirement of flip chip, and matches the packaging design of commercial TIAs, increasing the coupling aperture to ~20um.

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