Exhibitors Products Exhibit Profile Application Field Floor Plan

Silicon lens array for wafer bonding

Industry category:
Infrared Applications Expo
Product range:
Infrared Material
Application field:
Sensing & Measurement

Product Picture:

Product Presentation:

Silicon lenses and infrared focal plane imaging chips are stacked through wafer bonding and other methods to replace germanium/sulfur based glass lenses, effectively reducing the cost of infrared imaging and actively promoting the application market of infrared technology.

Exhibitor Information: