Exhibitors
Products
Exhibit Profile
Application Field
Floor Plan
Hakusan Inc.
Hall：
HALL 9
Booth No：
9B138
Exhibition Area：
Information and Communication Expo
Register
Invitation
Main product:
MT(12/16/24/32/36/48, SM&MM for Low Loss) with MPO Housing Kits
(available with Push-Pull boots)
Narrow-pitch MT ferrule(MTDS, 24x1row, 32x1row)
Reduced Cladding fiber MT ferrule(12/16/32 for 80m fiber)
Very small form factor(MTCOMPACT)
Reflowable MT ferrule (MTHR)
Ceramic Multifiber Ferrule(CMF)
Grin Lens Expanded Beam Connnector(GrinEB Connector)
MTCOMPACT Connector(MTCT Connector)
Exhibit Product:
Reflowable MT Ferrule(MTHR)
application area：
Optical Communication, Information Processing & Storage,Optical Communication Chip,Optical Communication Devices,Optical Fiber / Cable,Optical Subassembly,Internet and Data Centers
MTCT Connector
application area：
Optical Communication, Information Processing & Storage,Optical Communication Chip,Optical Communication Devices,Optical Communication Module,Optical Fiber / Cable,Optical Subassembly
CMF® – Ceramic Multifiber Ferrule
application area：
Optical Communication, Information Processing & Storage,Optical Communication Chip,Optical Communication Devices,Optical Communication Module,Optical Fiber / Cable,Communication Device
MTDS® – Narrow-Pitch MT Ferrule
application area：
Optical Communication, Information Processing & Storage,Optical Communication Chip,Optical Communication Devices,Optical Communication Module,Optical Fiber / Cable,Optical Subassembly
Hakusan MPO Connector
application area：
Optical Communication, Information Processing & Storage,Optical Communication Chip,Optical Communication Devices,Optical Communication Module,Optical Subassembly,Communication Device
Company Profile:
Hakusan specializes in the development and manufacturing of MT ferrules—core components of optical connectors—with a large global market share. We are showcasing our latest multi-fiber connector solutions, designed for high-density and high-speed transmission. These products meet the demanding requirements of AI data centers and optical transceivers, including compactness and heat resistance. Ideal for 800G/1.6T modules and CPO/OBO architectures, they are key enablers for photonics-electronics convergence and next-generation networks.
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09-10 Morning
09-10 afternoon
09-11 Morning
09-11 afternoon
09-12 Morning
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